Heating Bonding Machine

Heating Bonding Machine

Double-head pulse hot press machine equipment ,Double-head pulse hot press machine equipments,pulse hot press machine equipments,pulse hot press machine equipment.

Double-head pulse hot press machine equipment XCM63-B1

1.About the application field of Heating Bonding Machine equipment XCM63-B1

Heating Bonding Machine equipment XCM63-B1 is widely used in various capacitive touch screen (CTP), the liquid crystal display panel, and medium and small-sized production and assembly maintenance; such as. mobile phones, televisions (TV), laptop computers (NOTEBOOK), liquid crystal display (MONITOR), tablet PC (PAD), LCD / LCM production enterprises.

2.About the basic parameters of Heating Bonding Machineequipment XCM63-B1

Input Power. AC220V 50-60Hz

Operating modes. 7-inch HMI

Rated Power .6-7.5KW

Vacuum Processing. Built-vacuum

Working pressure .0.4-0 .8 Mpa

Pneumatic components. Japan SMC

For size. 7 inches (selected)

Pressure setting. SMC Precision Regulator

Work. fixed stage

Program control. PLC controller

Storage Parameters. 500 groups

Automatic elimination. twin eliminate weight

3.About the functions and characteristics of the Heating Bonding Machine equipment XCM63-B1

3.1 SUNSOM patent (Patent No. ZL201120120232.2). SUNSOM cylinder structure pressure system can eliminate weight of head, accurate pressure .

3.2 the temperature of up and down pulse heating curve is the same as digital temperature display.

3.3 three groups up and down Automatic roll the skin structure.

3.4 can store 500 groups of function parameters.

3.5 pulse source output parameters can be adjusted according to the power head.